Bostik 858 Low Pressure Injection Molding Hot Melt Adhesive

Low-pressure injection molding hot melt adhesive is primarily used in low-pressure injection molding processes. It is a plastic adhesive whose physical state changes within a certain temperature range while its chemical properties remain unchanged, making it an environmentally friendly chemical product. Its application fields are very broad, mainly used for the encapsulation and protection of precision and sensitive electronic components to achieve functions such as insulation, resistance to high and low temperatures, impact resistance, vibration damping, moisture resistance, waterproofing, dust resistance, oil resistance, and chemical corrosion resistance. Polyamide hot melt adhesive is a high-molecular thermoplastic polyamide resin synthesized based on dimer fatty acids. These fatty acids are derived from renewable resources such as soybeans, rapeseed, and sunflower seeds, and are then polycondensed into dimers. During the polycondensation process, the dimer fatty acids react with diamines, releasing water and forming polyamide hot melt adhesive. This product is non-corrosive, odorless, exhibits good adhesion to various substrates, and has low melt viscosity and excellent fluidity. Product features: 1. Extremely low injection pressure, non-damaging to components 2. Excellent adhesion to various plastics (such as PVC, PA66, PC, ABS, etc.) and metals. The product quality is guaranteed, the price is reasonable, and delivery is fast.